Business Model

Business Model

Overview

From Idea to Silicon: Leading the Future
of Custom ASIC Solutions

Alphachips offers a comprehensive ASIC total solution for next-generation SoCs,
driven by elite engineering capabilities and deep integration with the global foundry ecosystem.
Our bespoke services provide seamless execution across every stage of development,
including Front-end architecture, Back-end layout implementation, and manufacturing optimization for mass production.
We focus on the core essentials of semiconductor excellence—Power, Performance, Area, Cost (PPAC)—to ensure your product stands at the forefront of innovation

Key Strengths

Point 01. Advanced Process Experience
  • Proven experience in advanced node SoC development
  • Strong capability to support the latest foundry processes
  • Expertise in advanced node physical implementation up to 2nm
Point 02. Turn-key ASIC Solution Capability
  • End-to-end execution from architecture to tape-out
  • Integrated front-end and back-end development
  • Proven Verification & Production Support
Point 03. Global Foundry Ecosystem
  • Proven track record with top-tier global foundries
  • Comprehensive IP & EDA partner ecosystem
  • Reliable R&D and Manufacturing Infrastructure
Point 04. Optimized PPAC Engineering
  • Rigorous PPAC (Power, Performance, Area, Cost) optimization
  • High-performance, ultra-low power design capabilities
  • Engineering for Product Competitiveness
Point 05. Fast & Flexible Development
  • Rapid decision-making process
  • Tailored development support for customers
  • Flexible and efficient project execution structure
ASIC Business Flow

End-to-end ASIC Development Flow

Level 0

Architecture & System-Level Verification

The initial front-end phase focuses on defining the chip architecture and validating system functionality before implementation.
  • Top-Level Integration: Designing the high-level system structure by integrating various Intellectual Properties (IPs) and logic assets.
  • Bus Architecture Design: Configuring and optimizing internal data movement structures to ensure an efficient system architecture.
  • System-Level Verification: Rigorous functional validation of the chip from an end-to-end system perspective.
  • FPGA Emulation: Utilizing FPGA-based environments for pre-silicon validation to verify actual hardware behavior in advance.
Level 1

Logic Synthesis & Gate-Level Verification

The synthesis stage transforms RTL designs into physical gate-level circuits while optimizing timing.
  • RTL Synthesis: Converting RTL code into a concrete Gate-level Netlist.
  • Equivalence Checking: Formally verifying that the functional behavior of the Gate-level output matches the original RTL.
  • Static Timing Analysis (STA): Analyzing internal signal timing to ensure the design meets target frequency requirements.
  • Clock Generation Design: Architecting the clock structures that control the timing of all chip operations.
  • Test RTL Design: Pre-emptively incorporating dedicated test logic into the RTL code to facilitate downstream production testing.
Level 1.5

Design For Test (DFT)

A specialized stage dedicated to building the necessary infrastructure for detecting post-manufacturing defects.
  • DFT Implementation: Inserting test circuits such as Scan Chains to efficiently detect process defects after wafer production.
  • DFT Mode STA & Simulation: Analyzing test-mode timing and signal integrity to ensure reliable chip diagnostics.
  • DFT Vector Generation: Generating precise test patterns for ATE-based testing to detect defective silicon and ensure chip quality.
  • DFT-to-Gate Equivalence Check: Re-verifying that inserted test logic does not alter or compromise the chip's original functional logic.
Level 2

Physical Design

The critical Back-End stage where logical circuits are translated into actual silicon layout structures.
  • Place & Route (P&R): Executing cell placement and wire routing to realize an optimized physical layout.
  • Physical Verification: Ensuring layout integrity by verifying compliance with strict manufacturing process standards.
  • Post-Layout STA: Performing a final timing analysis that accounts for RC Delay generated by actual physical wiring.
  • Layout Equivalence Check: Confirming the final layout is perfectly synchronized with the Gate-level design.
Level 3

Tape-out & Manufacturing Support

The final closure phase focuses on resolving remaining errors and maximizing production yield before releasing the design to the foundry.
  • Design Rule Check (DRC): Final validation to ensure the design does not violate any foundry-specific manufacturing rules.
  • GDS Merge: Consolidating IP and standard cell data into a final unified format.
  • Design For Manufacturing (DFM): Performing manufacturing optimizations to enhance overall production yield.
  • Tape-out Support: Managing the delivery of the final GDSII files and supporting preparations for mass production.