Physical Design

Core 1: Comprehensive Physical Implementation Solution
Core 2: Optimizing Performance, Power and Manufacturability
Core 3: From Netlist to Manufacturing-ready Silicon

Overview

Comprehensive
Physical Implementation Solution

Alphachips provides physical implementation solutions covering the entire process, from design optimization to final tape-out, for the realization of high-performance SoCs. Based on proven implementation methodologies that consider performance, power, and manufacturability, we support stable silicon implementation and successful mass production.

ASIC Business Flow

Core Strengths & Capabilities

Alphachips delivers a complete front-end ASIC design flow, covering architecture, RTL development, verification, SoC integration, and performance optimization. Our proven methodologies support reliable and efficient semiconductor development from concept to implementation.

Advanced Physical Implementation: Advanced Process Experience

Large-Scale SoC Management

System Optimization
Timing Closure Capability: Advanced STA Methodology

Clock Structure Optimization

Timing Optimization Flow

Multi-mode Multi-corner (MMMC) Analysis
Power & Signal Integrity: Stability Verification

Low Power Optimization

Signal Integrity (SI) Optimization
Physical Verification: Foundry Rule Compliance

Layout Validation

Manufacturability Check
Manufacturing Readiness: Final Signoff Flow

GDSII/OASIS Generation

Yield Optimization

Manufacturing Support

Design Service

Physical Design Solutions

Alphachips delivers industry-validated Back-end solutions, spanning from Physical implementation based on Gate-level Netlists to achieving timing closure and power optimization, followed by rigorous physical verification and final tape-out support.

Physical Aware Synthesis

We design optimal physical structures and power architectures to enable the implementation of high-performance SoCs.

Core Capabilities: Floorplan Design

Macro Placement Optimization

Power Grid Planning

IO & Pin Placement

Physical Constraint Definition

Placement, CTS & Routing

We transform logical circuits into actual silicon layout structures while optimizing for timing and congestion.

Core Capabilities: Standard Cell Placement

CTS (Clock Tree Synthesis)

Routing Optimization

Congestion Analysis & Optimization

Physical-aware Optimization

Timing Closure & Signoff STA

We perform timing analysis and signoff to ensure the design meets target performance and frequency requirements.

Core Capabilities: Static Timing Analysis (STA)

Multi-mode Multi-corner (MMMC) Analysis

Clock Timing Optimization

Setup / Hold Timing Closure

ECO-based Timing Optimization

Power & Signal Integrity

We analyze power stability and signal quality to secure a stable and reliable silicon operating environment.

Core Capabilities: IR Drop Analysis

Electromigration (EM) Analysis

Crosstalk Analysis

Thermal Analysis

Low Power Optimization

Physical Verification & Signoff

We perform final validation of layout integrity and manufacturability based on strict manufacturing process standards.

Core Capabilities: DRC Verification

LVS (Layout vs. Schematic) Verification

Antenna Check

Density Verification

Signoff Validation

Tape-out & Manufacturing Support

We support final GDSII generation and delivery to the foundry to ensure high production yield and stability.

Core Capabilities: GDSII/OASIS Generation

Final Data Integrity Check

Foundry Interface Support

Tape-out Flow Management

Manufacturing Readiness Review

Design Applications

Supported Applications

Supported applications deliver key benefits such as optimized performance and power, improved design quality, enhanced manufacturability, stable tape-out execution, and reliable mass production support.

AI SoC
Automotive SoC
Consumer Electronics
High-performance Computing
Mobile & Connectivity
Industrial Semiconductor